DocumentCode :
1727442
Title :
Effects of particle size and amount of Al(OH)3 on silicone rubber for insulator
Author :
Park, H.Y. ; Kang, D.P. ; Ahn, M.S. ; Lee, T.H. ; Lee, D.I.
Author_Institution :
Adv. Electr. Mater. Res. Group, Korea Electrotechnol. Res. Inst., Changwon, South Korea
Volume :
2
fYear :
2004
Firstpage :
808
Abstract :
Silicone rubber has very excellent chemical stability and hydrophobicity. Silicone rubber has been used very much for housing materials of polymer insulator. Al(OH)3 is added to the silicone rubber for improvement of its resistance against surface discharge. Hydrophobicity recovery properties and arc resistance of silicone rubber could be different by the amount and particle size of Al(OH)3. In this paper, Al(OH)3 with different particle size was added to the silicone rubber during compounding. Silicone rubber was deteriorated by a corona treatment. Hydrophobicity recovery rate after corona treatment and arc resistance of silicone rubber were investigated. Hydrophobicity recovery rate of silicone rubber was evaluated by the measurement of contact angle. Arc resistance was evaluated by measuring weight loss of silicone rubber after arc resistance test. It was observed that the hydrophobicity recovery rate and arc resistance of silicone rubber were different according to different particle size and amount of Al(OH)3.
Keywords :
aluminium compounds; contact angle; particle size; plasma materials processing; polymer insulators; recovery; silicone rubber; surface treatment; Al(OH)3; arc resistance test; chemical stability; contact angle; corona treatment; housing materials; hydrophobicity; particle size; polymer insulator; recovery properties; recovery rate; silicone rubber; surface discharge; Chemicals; Corona; Electrical resistance measurement; Goniometers; Plastic insulation; Polymers; Rubber; Stability; Surface discharges; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
Print_ISBN :
0-7803-8348-6
Type :
conf
DOI :
10.1109/ICSD.2004.1350555
Filename :
1350555
Link To Document :
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