• DocumentCode
    1727451
  • Title

    Dipole controlled metal gate with hybrid low resistivity cladding for gate-last CMOS with low Vt

  • Author

    Hinkle, C.L. ; Galatage, R.V. ; Chapman, R.A. ; Vogel, E.M. ; Alshareef, H.N. ; Freeman, C. ; Wimmer, E. ; Niimi, H. ; Li-Fatou, A. ; Shaw, J.B. ; Chambers, J.J.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2010
  • Firstpage
    183
  • Lastpage
    184
  • Abstract
    In this contribution, NMOS and PMOS band edge effective work function (EWF) and correspondingly low Vt are demonstrated using standard fab materials and processes in a gate-last scheme. For NMOS, the use of an Al cladding layer results in Vt = 0.08 V consistent with NMOS EWF = 4.15 eV. Migration of the Al cladding into the TiN and a relatively low oxygen concentration near the TiN/HfO2 interface are responsible for the low EWF. For PMOS, employing a W cladding layer along with a post-TiN anneal in an oxidizing ambient results in elevated oxygen concentration near the TiN/HfO2 interface and Vt = -0.20 V consistent with a PMOS EWF =5.05 eV. First-principles calculations indicate N atoms displaced from the TiN during the oxidizing anneal form dipoles at the TiN/HfO2 interface that play a critical role in determining the PMOS EWF.
  • Keywords
    CMOS integrated circuits; MOSFET; annealing; hafnium compounds; titanium compounds; work function; NMOS band edge; PMOS band edge; TiN-HfO2; dipole controlled metal gate; effective work function; gate-last CMOS; low resistivity cladding; oxidizing anneal; oxygen concentration; Annealing; International Electron Devices Meeting; Logic gates; MOS devices; Materials; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2010 Symposium on
  • Conference_Location
    Honolulu
  • Print_ISBN
    978-1-4244-5451-8
  • Electronic_ISBN
    978-1-4244-5450-1
  • Type

    conf

  • DOI
    10.1109/VLSIT.2010.5556220
  • Filename
    5556220