DocumentCode
1727451
Title
Dipole controlled metal gate with hybrid low resistivity cladding for gate-last CMOS with low Vt
Author
Hinkle, C.L. ; Galatage, R.V. ; Chapman, R.A. ; Vogel, E.M. ; Alshareef, H.N. ; Freeman, C. ; Wimmer, E. ; Niimi, H. ; Li-Fatou, A. ; Shaw, J.B. ; Chambers, J.J.
Author_Institution
Dept. of Mater. Sci. & Eng., Univ. of Texas at Dallas, Richardson, TX, USA
fYear
2010
Firstpage
183
Lastpage
184
Abstract
In this contribution, NMOS and PMOS band edge effective work function (EWF) and correspondingly low Vt are demonstrated using standard fab materials and processes in a gate-last scheme. For NMOS, the use of an Al cladding layer results in Vt = 0.08 V consistent with NMOS EWF = 4.15 eV. Migration of the Al cladding into the TiN and a relatively low oxygen concentration near the TiN/HfO2 interface are responsible for the low EWF. For PMOS, employing a W cladding layer along with a post-TiN anneal in an oxidizing ambient results in elevated oxygen concentration near the TiN/HfO2 interface and Vt = -0.20 V consistent with a PMOS EWF =5.05 eV. First-principles calculations indicate N atoms displaced from the TiN during the oxidizing anneal form dipoles at the TiN/HfO2 interface that play a critical role in determining the PMOS EWF.
Keywords
CMOS integrated circuits; MOSFET; annealing; hafnium compounds; titanium compounds; work function; NMOS band edge; PMOS band edge; TiN-HfO2; dipole controlled metal gate; effective work function; gate-last CMOS; low resistivity cladding; oxidizing anneal; oxygen concentration; Annealing; International Electron Devices Meeting; Logic gates; MOS devices; Materials; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSIT), 2010 Symposium on
Conference_Location
Honolulu
Print_ISBN
978-1-4244-5451-8
Electronic_ISBN
978-1-4244-5450-1
Type
conf
DOI
10.1109/VLSIT.2010.5556220
Filename
5556220
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