Title :
In-situ characterization of moisture absorption-desorption and hygroscopic swelling behavior of an underfill material
Author_Institution :
Assembly Test & Technol. Dev., Intel Corp., Chandler, AZ, USA
Abstract :
Moisture absorption and hygroscopic swelling behavior of an underfill material were measured in-situ using the sorption TGA and the DMA-RH techniques, respectively. Results showed that moisture diffusion can be well described by Fick´s law when the relative humidity (RH) is 60% or less, and the diffusivity exhibits an Arrhenius temperature dependence with an activation energy of ~ 0.56 eV. At 85% RH, non-Fickian diffusion behavior becomes apparent in the latter stage of the diffusion process. Increase in the saturated moisture content (Csat) at 60%RH was observed after exposure at 85°C 85%RH, which is attributed to hygrothermal ageing induced damage in the material. In-situ DMA-RH results showed that hygroscopic swelling strain is significant comparing with the thermal expansion of the material, and the swelling strain at 60°C 60%RH is equivalent to the thermal strain over a ΔT of 100°C for T <; Tg. The coefficient of hygroscopic swelling (CHS) was calculated and the results showed that CHS is temperature dependent, and it increases with the increasing temperature. At higher humidity condition (85%RH or higher), the swelling strain deviates from its linear dependence on Csat and it increases faster than linear when Csat increases, which may also be attributed to hygrothermal ageing induced damage in the underfill material.
Keywords :
absorption; ageing; desorption; filled polymers; humidity; swelling; thermal analysis; thermal expansion; Arrhenius temperature; DMA-RH techniques; Fick´s law; hygroscopic swelling coefficient; hygrothermal ageing; moisture absorption-desorption; nonFickian diffusion; relative humidity; sorption TGA; underfill material; Absorption; Humidity; Materials; Moisture; Strain; Temperature dependence; Temperature measurement;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898541