• DocumentCode
    1727470
  • Title

    The effect of the temperature on the Bipolar Degradation of 3.3 kV 4H-SiC PiN diodes

  • Author

    Brosselard, P. ; Tómas, A. Perez ; Camara, N. ; Hassan, J. ; Jordà, X. ; Vellvehi, M. ; Godignon, P. ; Millán, J. ; Bergman, J.P.

  • Author_Institution
    CNM-CSIC, Centro Nat. de Microelectron., Barcelona
  • fYear
    2008
  • Firstpage
    237
  • Lastpage
    240
  • Abstract
    Abstract- 4H-SiC PiN diodes have been manufactured on a Norstel epitaxied P+ZN/N* substrate with a combination of Mesa and JTE as edge termination. A breakdown voltage of 3.3 kV has been measured at lmuA regardless the active area (0.16 and 2.56 mm2). A differential on-resistance of 1.7 mOmega.cm2 was extracted at 15A-25degC. The recovery charge was only of 300 nC for a switched current of 15A at 300degC at a blocking voltage of 500V. 50% of the diodes exhibit a voltage shift of about IV, after a 60 hours DC- stress (25degC-225degC). The leakage current level remains unaffected after the DC stress.
  • Keywords
    avalanche diodes; bipolar integrated circuits; epitaxial layers; leakage currents; p-i-n diodes; substrates; switched current circuits; DC stress; Norstel; PiN diodes; bipolar degradation; blocking voltage; breakdown voltage; leakage current level; switched current; voltage shift; Anodes; Area measurement; Degradation; Leakage current; Manufacturing; Semiconductor diodes; Stress; Substrates; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4244-1532-8
  • Electronic_ISBN
    978-1-4244-1533-5
  • Type

    conf

  • DOI
    10.1109/ISPSD.2008.4538942
  • Filename
    4538942