DocumentCode :
1727500
Title :
Direct observation of RTN-induced SRAM failure by accelerated testing and its application to product reliability assessment
Author :
Takeuchi, K. ; Nagumo, T. ; Takeda, K. ; Asayama, S. ; Yokogawa, S. ; Imai, K. ; Hayashi, Y.
Author_Institution :
LSI Fundamental Res. Lab., NEC Electron. Corp., Sagamihara, Japan
fYear :
2010
Firstpage :
189
Lastpage :
190
Abstract :
A new accelerated testing scheme for detecting SRAM bit failure caused by random telegraph noise (RTN) is proposed. By repeatedly monitoring the fail bit count (FBC) under a reduced margin operation condition, increasing trend of FBC along time was clearly observed, which is believed to be caused by RTN. In addition, physics-based ultra-fast Monte Carlo RTN simulation program has been developed, which quantitatively reproduces the test results. By using the simulation calibrated by the test, product reliability against RTN can be accurately predicted.
Keywords :
Monte Carlo methods; SRAM chips; integrated circuit noise; integrated circuit reliability; integrated circuit testing; life testing; random noise; RTN; SRAM bit failure; accelerated testing; fail bit count; product reliability assessment; random telegraph noise; reduced margin operation; ultrafast Monte Carlo simulation; FETs; Fluctuations; Life estimation; Noise; Random access memory; Resource description framework; Semiconductor process modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSIT), 2010 Symposium on
Conference_Location :
Honolulu
Print_ISBN :
978-1-4244-5451-8
Electronic_ISBN :
978-1-4244-5450-1
Type :
conf
DOI :
10.1109/VLSIT.2010.5556222
Filename :
5556222
Link To Document :
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