DocumentCode
1727673
Title
4.5 kV 1000 A Class SiC pn Diode Modules with Resin Mold Package and Ceramic Flat Package
Author
Sugawara, Y. ; Ogata, S. ; Okada, S. ; Izumi, T. ; Miyanagi, Y. ; Asano, K. ; Nakayama, K. ; Tanaka, A.
Author_Institution
Power Eng. R&D Center, Amagasaki
fYear
2008
Firstpage
267
Lastpage
270
Abstract
4.5 kV 1000 A class high heat resistive SiC pn diode modules of both a resin mold package type using a new mold resin, Nanotec-resin KA 500, and a ceramic flat package type using a new ACTSG technique were developed for the first time. The resin mold module has a much smaller trr and Qrr in addition to higher Tj (max) of 300 degC as compared with Si pn diodes.
Keywords
ceramics; resins; semiconductor device packaging; semiconductor diodes; ceramic flat package; pn diode; resin mold package; Ceramics; Electrodes; Packaging; Power generation; Resins; Scattering; Semiconductor diodes; Silicon carbide; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
Conference_Location
Orlando, FL
Print_ISBN
978-1-4244-1532-8
Electronic_ISBN
978-1-4244-1533-5
Type
conf
DOI
10.1109/ISPSD.2008.4538950
Filename
4538950
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