The future of dielectric materials in electronic power processing

This paper discusses future directions of technology development for electronic power processing. These power electronic converters are synthesized from groups of standard building blocks, comprising of active power switching cells, integrated electromagnetic power passive cells and integrated electromagnetic interference filter cells. These cells use a hybrid integration technology, combining many layers of materials, including solid dielectric materials. The coupled electromagnetic-thermal-mechanical nature of the constructions poses unconventional and challenging requirements to all the materials, including the dielectrics in terms of interface, thermal and mechanical considerations. The considerations are illustrated by discussing case studies of such types of standard cells that were developed in the course of recent research on the development of the technology for future power electronics integration.