Title :
An accurate and fast 3D numerical approach to power/signal and thermal co-simulation
Author :
Ai, Xin ; Kuo, An-Yu ; Baida, Mazen ; Chase, Yun
Author_Institution :
Sigrity, Inc., Campbell, CA, USA
Abstract :
As electronic designs are getting to a higher density and current level, demands for integration of power/signal and thermal analysis is growing. A 3D electrical/thermal co-simulation algorithm is presented in the paper. This approach provides very detailed solutions with high accuracy and efficiency.
Keywords :
circuit simulation; thermal analysis; three-dimensional integrated circuits; 3D electrical/thermal co-simulation algorithm; electronic designs; power/signal integration; thermal analysis; Conductivity; Finite element methods; Resistance heating; Temperature distribution; Thermal analysis; Thermal conductivity;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898555
