Title :
A novel low temperature bonding technique for plastic substrates using X-ray irradiation
Author :
Hyun Sup Lee ; Dong Sung Kim ; Tai Hun Kwon
Author_Institution :
Pohang Univ. of Sci. & Technol., South Korea
Abstract :
The present study proposes a new low temperature bonding technique for two plastic substrates using deep X-ray irradiation. The deep X-ray irradiation causes the decrease of molecular weight of PMMA, which in turn decreases the glass transition temperature (T/sub g/). Lowered T/sub g/ on the surface of two PMMA sheets makes bonding possible at low temperature. The present study also offers a tool to predict the decrease of T/sub g/ based on the relationship between X-ray dose and molecular weight. Bonding experiments are conducted at various bonding temperatures near the desired T/sub g/. Then, the bonding strength is measured by means of a tensile test machine (MTS system). The bonding is found to be successfully achieved when the bonding temperature is 8/spl sim/15/spl deg/C higher than the desired T/sub g/. The bonding strength is about 0.96 MPa.
Keywords :
X-ray effects; bonding processes; glass transition; plastics; polymers; tensile testing; 8 to 15 degC; PMMA sheets; X-ray irradiation; bonding strength; glass transition temperature; low temperature bonding; plastic substrates; tensile test machine; Bonding; Equations; Glass; Microfluidics; Plasma temperature; Plastics; Pollution measurement; Polymers; System testing; Tellurium;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1217019
