Glass panel processing for electrical and optical packaging

Glass is a perfect substrate material for electrical and optical packaging. The integration concept to bridge board and chip level using thin glass substrates by lamination in between of PCB base material will be presented. Different thin glasses are commercial available and will be reviewed. Furthermore the paper reviews glass panel processing in the area of display and electro/optical packaging focusing on integration advantages for photonic packaging. Ion exchange technology for large panel processing to integrate high-performing optical waveguides will be demonstrated for multi-mode beam propagation. Based on glass based photonic system-in-package (SiP) which is done on wafer level the up scaling on panel size of those processes is discussed in detail and experimental results are presented.