DocumentCode :
1728294
Title :
Temperature dependence of mechanical properties of isotropic conductive adhesive filled with metal coated polymer spheres
Author :
Nguyen, Hoang-Vu ; Kristiansen, Helge ; Johannessen, Rolf ; Andreassen, Erik ; Larsson, Andreas ; Hoivik, Nils ; Aasmundtveit, Knut E.
Author_Institution :
Dept. of Micro & Nano Syst. Technol., HiVe-Vestfold Univ. Coll., Borre, Norway
fYear :
2011
Firstpage :
639
Lastpage :
644
Abstract :
An isotropic conductive adhesive (ICA) filled with metal-coated polymer spheres (MPS) has been studied as a novel approach to increase the flexibility, and hence the reliability, compared to the conventional metal-filled ICA. In this study, the effect of the metal coating on the die shear strength was investigated by comparing ICA materials with coated and uncoated polymer spheres. The other important part of the study was to assess the temperature dependence of the die shear strength of an MPS-based ICA, and also compare this with the behavior of a conventional ICA filled with Ag particles. The results showed that the metal coating does not have a critical effect on the die shear strength of ICA filled with MPS. The die shear strengths obtained for the MPS-based ICA and the conventional Ag-filled ICA have the same temperature dependence in the range of 20°C to 120°C. Furthermore, none of the ICA systems has experienced a critical drop in die shear strength at and above the glass transition temperature.
Keywords :
conductive adhesives; electronics packaging; glass; polymers; shear strength; MPS; conventional metal-filled ICA; die shear strength; glass transition temperature; isotropic conductive adhesive; mechanical property; metal coated polymer sphere; metal coating; Aluminum oxide; Coatings; Polymers; Substrates; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2011.5898580
Filename :
5898580
Link To Document :
بازگشت