Title :
Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging
Author :
Suk, Kyoung-Lim ; Chung, Chang-Kyu ; Paik, Kyung-Wook
Author_Institution :
Dept. of Mater. Sci. & Eng., KAIST, Daejeon, South Korea
Abstract :
Nanofiber ACFs composed of adhesive resins, conductive particles, and nanofibers were demonstrated for ultra fine pitch COF packages. PAN nanofibers and PAN nanofiber containing conductive particles inside the fibers were successfully produced using electrospinning methods. The effects of nanofiber thickness and structure on electrical properties of nanofiber ACFs were investigated.
Keywords :
adhesives; chip-on-board packaging; nanofibres; adhesive resins; chip on film packaging; conductive particles; electrical properties; electrospinning methods; nanofiber anisotropic conductive adhesives; ultra fine pitch; Bonding; Insulation; Morphology; Needles; Polymers; Resins;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898583
