• DocumentCode
    1728584
  • Title

    Development of surface micromachinable capacitive accelerometer using fringe electrical field

  • Author

    Aoyagi, S. ; Yu-Chong Tai

  • Author_Institution
    Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
  • Volume
    2
  • fYear
    2003
  • Firstpage
    1383
  • Abstract
    This paper demonstrates a new type accelerometer, which consists of a dielectric seismic mass and comb-shaped planar capacitor underneath it. The simple structure of the device allows using polymer Parylene as the proof mass, so the technology is greatly simplified and only surface micromachining is required. Measuring principle is detecting capacitance change according to the dielectric mass movement in the fringe electrical field. This principle is verified by FEM simulation. Prototype accelerometers are fabricated and calibrated with the aid of off-chip capacitive readout IC.
  • Keywords
    accelerometers; calibration; capacitance; capacitors; electric field effects; finite element analysis; integrated circuit design; microsensors; polymers; readout electronics; FEM simulation; capacitance; comb shaped planar capacitor; dielectric seismic mass; fringe electrical field; off chip capacitive readout IC; polymer Parylene; prototype accelerometers; surface micromachinable capacitive accelerometer; surface micromachining; Accelerometers; Capacitance measurement; Capacitors; Dielectric measurements; Dielectric substrates; Electric variables measurement; Electrodes; Polymers; Seismic measurements; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1217032
  • Filename
    1217032