Title :
A new thermomechanical fracture analysis approach for 3D integration technology
Author :
Agwai, Abigail ; Guven, Ibrahim ; Madenci, Erdogan
Author_Institution :
Aerosp. & Mech. Eng. Dept., Univ. of Arizona, Tucson, AZ, USA
Abstract :
In this study, the peridynamic framework is applied to model heat diffusion to derive peridynamic heat diffusion equations. A numerical scheme is put forward and implemented in order to establish the validity of these equations. Finally, an approach is developed for coupled solution of heat conduction and solid mechanics equations in the realm of peridynamics.
Keywords :
heat conduction; integrated circuit packaging; three-dimensional integrated circuits; 3D integration technology; coupled solution; heat conduction; peridynamic framework; peridynamic heat diffusion equations; solid mechanics equations; thermomechanical fracture analysis approach; Equations; Finite element methods; Heating; Mathematical model; Solids; Steady-state;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898595
