DocumentCode :
1728838
Title :
Dual-layer WDM routing for wafer-scale packaging of photonically-interconnected computing systems
Author :
Lee, Daniel C. ; Zheng, Xuezhe ; Feng, Dazeng ; Kung, Cheng-Chih ; Fong, Joan ; Qian, Wei ; Yao, Jin ; Li, Guoliang ; Raj, Kannan ; Cunningham, John E. ; Krishnamoorthy, Ashok V. ; Asghari, Mehdi
Author_Institution :
Kotura, Inc., Monterey Park, CA, USA
fYear :
2011
Firstpage :
812
Lastpage :
818
Abstract :
As an enabling building block to support high bandwidth optical interconnections among supercomputing processing elements, we present the first monolithically integrated chip-to-chip wavelength-division multiplexing (WDM) optical proximity coupler with 4-channel × 200GHz-spacing multiplexer/demultiplexer (MUX/DEMUX) functionality utilizing an echelle grating, micro reflective mirrors, and waveguide mode transformers on single silicon-on-insulator (SOI) substrate. This new photonic integrated circuits can be utilized to provide a data-rate independent optical interface that surpasses the throughput bottleneck of current electrical data paths.
Keywords :
demultiplexing equipment; diffraction gratings; integrated optics; mainframes; micromirrors; monolithic integrated circuits; multiplexing equipment; network routing; optical couplers; optical interconnections; optical waveguides; silicon-on-insulator; wafer level packaging; wavelength division multiplexing; MUX-DEMUX; SOI substrate; data-rate independent optical interface; demultiplexer; dual-layer WDM routing; echelle grating; microreflective mirror; monolithically integrated chip-to-chip wavelength-division multiplexing optical proximity coupler; multiplexer; optical interconnection; photonic integrated circuits; photonically-interconnected computing system; silicon-on-insulator substrate; supercomputing processing element; wafer-scale packaging; waveguide mode transformer; Couplers; Loss measurement; Mirrors; Optical coupling; Optical waveguides; Silicon; Wavelength division multiplexing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2011.5898604
Filename :
5898604
Link To Document :
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