Dual-layer WDM routing for wafer-scale packaging of photonically-interconnected computing systems

Author

Lee, Daniel C. ; Zheng, Xuezhe ; Feng, Dazeng ; Kung, Cheng-Chih ; Fong, Joan ; Qian, Wei ; Yao, Jin ; Li, Guoliang ; Raj, Kannan ; Cunningham, John E. ; Krishnamoorthy, Ashok V. ; Asghari, Mehdi

Author_Institution

Kotura, Inc., Monterey Park, CA, USA

fYear

2011

Firstpage

812

Lastpage

818

Abstract

As an enabling building block to support high bandwidth optical interconnections among supercomputing processing elements, we present the first monolithically integrated chip-to-chip wavelength-division multiplexing (WDM) optical proximity coupler with 4-channel × 200GHz-spacing multiplexer/demultiplexer (MUX/DEMUX) functionality utilizing an echelle grating, micro reflective mirrors, and waveguide mode transformers on single silicon-on-insulator (SOI) substrate. This new photonic integrated circuits can be utilized to provide a data-rate independent optical interface that surpasses the throughput bottleneck of current electrical data paths.

Keywords

demultiplexing equipment; diffraction gratings; integrated optics; mainframes; micromirrors; monolithic integrated circuits; multiplexing equipment; network routing; optical couplers; optical interconnections; optical waveguides; silicon-on-insulator; wafer level packaging; wavelength division multiplexing; MUX-DEMUX; SOI substrate; data-rate independent optical interface; demultiplexer; dual-layer WDM routing; echelle grating; microreflective mirror; monolithically integrated chip-to-chip wavelength-division multiplexing optical proximity coupler; multiplexer; optical interconnection; photonic integrated circuits; photonically-interconnected computing system; silicon-on-insulator substrate; supercomputing processing element; wafer-scale packaging; waveguide mode transformer; Couplers; Loss measurement; Mirrors; Optical coupling; Optical waveguides; Silicon; Wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-61284-497-8

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2011.5898604

Filename

5898604