Planar assembled flexible interconnect link with hybrid optical/electrical data transmission for mobile device applications

New serial data transmission standards for cameras and displays in mobile devices are demanding low power multi-gigabit high speed serial links which must operate in noisy RF environments. [1] To meet these requirements a hybrid optical/electrical interconnect link is proposed. By combining a traditional flexible electrical interconnect with an advanced low power optical interconnect it is possible to meet the demands of this future market. The two key developments discussed in this paper are: the electrical/optical switching system, which is the basis for the hybrid link, and the all planar assembly process, featuring an edge emitting laser diode, edge receiving photodiode and a flexible polymer waveguide.