Title :
Popcorn cracking in a plastic ball grid array package
Author :
Shioda, Tsuyoshi ; Tanaka, Junsuke ; Hagimura, Atsushi
Author_Institution :
Electron. & Recording Mater. Lab., Mitsui Chem. Inc., Yokahama, Japan
Abstract :
The preconditioning testing (85°C/85% RH or 6O% RH/168 hrs) for a plastic ball grid array (PBGA) package was carried out. The use of a substrate with relatively high rigidity at temperatures higher than 200°C resulted in improvement of the popcorn cracking resistance during IR reflow. This result was reasonably explained to be due to the relatively large compressive stress between chip and substrate induced by its high rigidity. Further improvement was observed by increasing the thickness of the solder resist (SR) or the Ag-filled die attach (DA) layer
Keywords :
adhesives; ball grid arrays; humidity; integrated circuit packaging; internal stresses; microassembling; plastic packaging; printed circuit manufacture; printed circuit testing; reflow soldering; shear modulus; thermal stress cracking; thermal stresses; 168 hr; 200 C; 85 C; Ag; Ag-filled die attach layer thickness; IR reflow; PBGA package; chip-substrate compressive stress; plastic ball grid array package; popcorn cracking; popcorn cracking resistance; preconditioning testing; rigidity; solder resist thickness; substrate rigidity; Electronic equipment testing; Electronics packaging; Glass; Mechanical factors; Microassembly; Moisture; Plastic packaging; Resists; Strontium; Temperature;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704621
