• DocumentCode
    1729509
  • Title

    High bandwidth RDRAM technology reduces system cost

  • Author

    Crisp, R.

  • Author_Institution
    Rambus Inc., USA
  • fYear
    1996
  • Firstpage
    365
  • Lastpage
    377
  • Abstract
    Rambus DRAMs (RDRAMs) combine high bandwidth, high density, low pincount, and low cost to provide cost savings in high volume applications such as PC graphics and PC main memory. Using advanced circuit design techniques with ordinary CMOS processing and plastic packaging, RDRAMs provide a minimum 8/spl times/ pin data rate advantage over the latest SDRAM technology resulting in single chip granularity, decreased pin counts, smaller controller chip size, lower cost sockets, and simplified PC board design. With 6 manufacturers producing RDRAMs, high volume users in the video games, PC multimedia, engineering workstations and PC main memory markets have begun to ship production quantities of new products assured of adequate supply at competitive pricing. Late new concurrent architecture in the 64 Mb, generation device is specifically optimized for use in next generation PCs, offering advantages in bandwidth, latency, granularity, scalability, and memory expansion over next generation EDO and SDRAMs.
  • Keywords
    CMOS memory circuits; DRAM chips; costing; microprocessor chips; network synthesis; performance evaluation; plastic packaging; CMOS processing; PC board design; RDRAM; Rambus DRAM; SDRAM; advanced circuit design; computer graphics; controller chip size; engineering workstations; high bandwidth; high density; low cost; low pincount; main memory; memory expansion; multimedia; pin data rate; plastic packaging; single chip granularity; sockets; system cost; video games; Bandwidth; CMOS memory circuits; CMOS process; CMOS technology; Circuit synthesis; Costs; Graphics; Plastic packaging; Random access memory; SDRAM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compcon '96. 'Technologies for the Information Superhighway' Digest of Papers
  • Conference_Location
    Santa Clara, CA, USA
  • ISSN
    1063-6390
  • Print_ISBN
    0-8186-7414-8
  • Type

    conf

  • DOI
    10.1109/CMPCON.1996.501797
  • Filename
    501797