Author :
Horibe, A. ; Paquet, M.-C. ; Gaynes, M. ; Feger, C. ; Sakuma, K. ; Knickerbocker, J.U. ; Orii, Y. ; Hoshiyama, M. ; Hasegawa, M. ; Sato, T. ; Yoshii, H. ; Suzuki, O. ; Kotaka, K. ; Nagasaka, T. ; Terada, K. ; Ishikawa, K. ; Hirayama, Y.
Abstract :
We developed vacuum assisted underfill technology for large die (>;18 × 18 mm) with fine pitch area array bumps (<; 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for such an advanced package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package.
Keywords :
integrated circuit reliability; microassembling; optimisation; system-in-package; advanced packaging; die package; fine pitch area array bump; material development; process optimization; reliability; underfill void issue; vacuum assisted underfill technology; Adhesives; Delamination; Materials reliability; Substrates; Vehicles;
