DocumentCode
1729882
Title
Substrate bias effects on short channel length and narrow channel width PMOS devices at cryogenic temperatures
Author
Deen, M.J. ; Wang, J. ; Yan, Z.X. ; Zuo, Z.P.
Author_Institution
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
fYear
1989
Firstpage
53
Lastpage
57
Abstract
The effects of substrate biasing on the characteristics of PMOS devices with varying channel lengths and widths were studied as a function of temperature from 300 K to 77 K. Results on the low field intrinsic mobility, the mobility surface and substrate bias degradation constants, and the effective low field mobility are discussed. The variation of the peak substrate current normalized to the drain current and of drain-induced-barrier-lowering with substrate bias for both groups of devices is also presented and discussed
Keywords
carrier mobility; cryogenics; insulated gate field effect transistors; semiconductor device testing; 77 to 300 K; PMOS devices; cryogenic temperatures; drain current; drain-induced-barrier-lowering; effective low field mobility; low field intrinsic mobility; mobility surface; narrow channel width; peak substrate current; short channel length; substrate bias degradation constants; substrate biasing; Cryogenics; Degradation; Doping; Integrated circuit interconnections; MOS devices; Rough surfaces; Surface resistance; Surface roughness; Tellurium; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Semiconductor Electronics, 1989., Proceedings of the Workshop on
Conference_Location
Burlington, VT
Type
conf
DOI
10.1109/LTSE.1989.50181
Filename
50181
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