DocumentCode :
1729994
Title :
Electro-thermal characterization of Si-Ge HBTs with pulse measurement and transient simulation
Author :
Sahoo, Amit Kumar ; Fregonese, Sébastien ; Weiss, Michael ; Malbert, Nathalie ; Zimmer, Thomas
Author_Institution :
Lab. IMS, Univ. de Bordeaux 1, Talence, France
fYear :
2011
Firstpage :
239
Lastpage :
242
Abstract :
This paper describes a new and simple approach to accurately characterize the transient self-heating effect in Si-Ge Heterojunction Bipolar Transistors (HBTs), based on pulse measurements and verified through transient electro-thermal simulations. The measurements have been carried out over pulses applied at Base and Collector terminals simultaneously and the time response of Collector current increase due to self-heating effect are obtained. Compared to previous approach, a complete calibration has been performed including all the passive elements such as coaxial cables, connectors and bias network. Furthermore, time domain junction temperature variations, current of heat flux and lattice temperature distribution have been obtained numerically by means of 3D electro-thermal device simulations. The thermal parameters extracted from measurements using HiCuM HBT compact model have been verified with the parameters extracted from electro-thermal transient simulation. It has been shown that, the standard R-C thermal network is not sufficient to accurately model the thermal spreading behavior and therefore a recursive network has been employed which is more physical and suitable for transient electro-thermal modeling.
Keywords :
Ge-Si alloys; heterojunction bipolar transistors; pulse measurement; time-domain analysis; 3D electro-thermal device simulations; HBT; R-C thermal network; Si-Ge; bias network; calibration; coaxial cables; heat flux; heterojunction bipolar transistors; lattice temperature distribution; parameter extraction; passive elements; pulse measurement; self-heating effect; time domain junction temperature variations; transient simulation; Current measurement; Heating; Numerical models; Pulse measurements; Temperature measurement; Thermal resistance; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference (ESSDERC), 2011 Proceedings of the European
Conference_Location :
Helsinki
ISSN :
1930-8876
Print_ISBN :
978-1-4577-0707-0
Electronic_ISBN :
1930-8876
Type :
conf
DOI :
10.1109/ESSDERC.2011.6044190
Filename :
6044190
Link To Document :
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