DocumentCode
1730026
Title
Temperature dependence of SiC thin film metal-insulator-metal (MIM) capacitors on alumina over a temperature range from 25 to 500ºC
Author
Scardelletti, Maximilian C. ; Ponchak, George E. ; Jordan, Jennifer L. ; Varaljay, Nicholas C. ; McQuaid, Elizabeth A. ; Zorman, Christian A.
Author_Institution
NASA Glenn Res. Center, Cleveland, OH, USA
fYear
2011
Firstpage
1058
Lastpage
1063
Abstract
In this paper, we present the design, fabrication and characterization of thin film, silicon carbide (SiC) metal-insulator-metal capacitors over a temperature range of 25 to 500°C. The 600 nm thick silicon carbide insulating film was grown with a plasma enhanced chemical vapor deposition unit at 300 and 450°C. Two bottom electrode metal alloys were investigated to determine their effects at higher temperatures on the capacitor reliability. Five capacitor geometries with areas of 0.029, 0.144, 0.292, 0.436 and 0.593 mm2 were measured on a high temperature probe station over a frequency range from 10 MHz to 10 GHz. The S-parameters were measured on a vector network analyzer and the lumped circuit model was extracted using Agilent´s Advanced Design System™ software suite. The dielectric constant was extracted from the measured capacitance values. A C-V meter was also used to determine the capacitance and conductance.
Keywords
MIM devices; chemical vapour deposition; thin film capacitors; alumina; capacitance; capacitor geometry; capacitor reliability; conductance; dielectric constant; high temperature probe station; lumped circuit model; plasma enhanced chemical vapor deposition; silicon carbide insulating film; silicon carbide metal-insulator-metal capacitors; temperature dependence; thin film metal-insulator-metal capacitors; vector network analyzer; Capacitance; Capacitors; Gold; Silicon carbide; Substrates; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898641
Filename
5898641
Link To Document