• DocumentCode
    1730026
  • Title

    Temperature dependence of SiC thin film metal-insulator-metal (MIM) capacitors on alumina over a temperature range from 25 to 500ºC

  • Author

    Scardelletti, Maximilian C. ; Ponchak, George E. ; Jordan, Jennifer L. ; Varaljay, Nicholas C. ; McQuaid, Elizabeth A. ; Zorman, Christian A.

  • Author_Institution
    NASA Glenn Res. Center, Cleveland, OH, USA
  • fYear
    2011
  • Firstpage
    1058
  • Lastpage
    1063
  • Abstract
    In this paper, we present the design, fabrication and characterization of thin film, silicon carbide (SiC) metal-insulator-metal capacitors over a temperature range of 25 to 500°C. The 600 nm thick silicon carbide insulating film was grown with a plasma enhanced chemical vapor deposition unit at 300 and 450°C. Two bottom electrode metal alloys were investigated to determine their effects at higher temperatures on the capacitor reliability. Five capacitor geometries with areas of 0.029, 0.144, 0.292, 0.436 and 0.593 mm2 were measured on a high temperature probe station over a frequency range from 10 MHz to 10 GHz. The S-parameters were measured on a vector network analyzer and the lumped circuit model was extracted using Agilent´s Advanced Design System™ software suite. The dielectric constant was extracted from the measured capacitance values. A C-V meter was also used to determine the capacitance and conductance.
  • Keywords
    MIM devices; chemical vapour deposition; thin film capacitors; alumina; capacitance; capacitor geometry; capacitor reliability; conductance; dielectric constant; high temperature probe station; lumped circuit model; plasma enhanced chemical vapor deposition; silicon carbide insulating film; silicon carbide metal-insulator-metal capacitors; temperature dependence; thin film metal-insulator-metal capacitors; vector network analyzer; Capacitance; Capacitors; Gold; Silicon carbide; Substrates; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-61284-497-8
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2011.5898641
  • Filename
    5898641