Title :
Reliability investigations of printed circuit boards
Author_Institution :
Hewlett-Packard GmbH, Boblingen, Germany
Abstract :
Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered
Keywords :
circuit reliability; metallisation; printed circuit testing; printed circuits; surface treatment; Cu; PCB base materials; board inner layer connections; board outer layer connections; performance measures; plated Cu-thickness; printed circuit boards; reliability; surface finish aspect ratio; surface finish metallization; Assembly; Electric shock; Inorganic materials; Life testing; Materials reliability; Metallization; Printed circuits; Production; Temperature; Vehicles;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704628
