DocumentCode
1730625
Title
The future of 3D packaging
Author
Val, C.M.
Author_Institution
3D PLUS, France
fYear
1998
Firstpage
261
Lastpage
271
Abstract
Trends in interconnection techniques from 2D to 3D modules are presented. Historically, the different 3D interconnection techniques have been applied to memory modules for two reasons: market forces and simplicity. The development and manufacturing of 3D modules, firstly at Thomson-CSF from 1988 and subsequently at 3D PLUS from October 1995, addressed a variety of applications, including memory modules, calculation nodes, and microsystems. These different applications and perspectives are presented in this paper.
Keywords
integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated memory circuits; micromechanical devices; multichip modules; 2D modules; 3D interconnection techniques; 3D modules; 3D packaging; calculation nodes; interconnection techniques; manufacturing; market forces; memory modules; microsystems; Costs; Electronics packaging; Frequency; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit reliability; Manufacturing; Microprocessors; Multichip modules; Packaging machines;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 2nd 1998
Conference_Location
Tokyo, Japan
Print_ISBN
0-7803-5090-1
Type
conf
DOI
10.1109/IEMTIM.1998.704633
Filename
704633
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