Knowledge-based reliability qualification and an acceleration model for lead-free solder joint

Lead free solder joints in surface mount packages like ball grid array (BGA) have a great impact on the reliability of final products. In this study, the approach to knowledge-based qualification for solder joint reliability is fully described. An acceleration failure model has been derived for Sn3.0Ag0.5Cu based solder joint interconnect with dual inline memory module (DIMM) applications and to extract the parameters for Norris-Landzberg type model, accelerated thermal cycling (ATC) was performed and to correlated. The level of field risk assurance has been estimated based on several ATC conditions, sample size and the proper qualification for solder joint reliability has been proposed based on real operating conditions of memory module applications using health monitoring concept.