• DocumentCode
    173088
  • Title

    Simulation modeling and visualization of start-up transient processes of dual-arm cluster tools with wafer revisiting

  • Author

    ChunRong Pan ; Mengchu Zhou ; Yan Qiao ; NaiQi Wu

  • Author_Institution
    Dept. of Mechatornics Eng., Jiangxi Univ. of Sci. & Technol., Ganzhou, China
  • fYear
    2014
  • fDate
    5-8 Oct. 2014
  • Firstpage
    133
  • Lastpage
    138
  • Abstract
    The trends of increasing wafer diameter and smaller lot sizes from 25 wafers to a few wafers have led to more transient periods in wafer fabrication, thereby requiring more research on the optimal execution of transient processes. For some wafer fabrication processes, such as atomic layer deposition (ALD), wafers need to visit some process modules for a number of times, instead of once, thus leading to a so-called revisiting process. Research on transient processes of dual-arm cluster tools with wafer revisit processes becomes urgently needed for high-performance wafer fabrication. A cluster tool has no buffer except its robot, which makes its scheduling difficult. Thus, in order to study a cluster tool with revisiting process, a simulation system is helpful. This work develops a simulation model and system for a dual-arm cluster tool with a wafer revisit by using eM-Plant as a simulation platform. The resultant simulation system can be used for analysis and optimization of transient processes. An illustrative example is given to show its applications.
  • Keywords
    optimisation; production engineering computing; semiconductor industry; semiconductor technology; simulation; dual-arm cluster tools; eM-Plant simulation software; semiconductor manufacturing system; start-up transient process optimization; wafer fabrication; wafer revisit processes; Fabrication; Object oriented modeling; Robots; Schedules; Semiconductor device modeling; Steady-state; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems, Man and Cybernetics (SMC), 2014 IEEE International Conference on
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/SMC.2014.6973896
  • Filename
    6973896