Title :
3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance
Author :
Sun, X. ; Posada, G. ; Majeed, B. ; Zhang, W. ; De Raedt, W. ; Diekmann, C. ; Eggs, C. ; Schmidhammer, E.
Author_Institution :
Imec, Leuven, Belgium
Abstract :
This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.
Keywords :
bulk acoustic wave devices; electronics packaging; integrated circuit interconnections; solders; 3D integration; 3D packaging demonstrator; 3D stack packaging; BAW devices; FBAR devices; RF performance; bumps; low loss interconnects; solder ring; through substrate via; Film bulk acoustic resonators; Impedance matching; Inductors; Loss measurement; Packaging; Radio frequency; Three dimensional displays; 3D stack; Balun; FBAR; IMEC thin film technology; Inductor; Packaging; RF interconnection;
Conference_Titel :
Solid-State Device Research Conference (ESSDERC), 2011 Proceedings of the European
Conference_Location :
Helsinki
Print_ISBN :
978-1-4577-0707-0
Electronic_ISBN :
1930-8876
DOI :
10.1109/ESSDERC.2011.6044218
