Title :
Packaging of Ka-band patch antenna and optoelectronic components for dual-mode indoor wireless communication
Author :
Liao, Jun ; Wu, Pengfei ; Mirvakili, Ali ; Joyner, Valencia ; Huang, Z. Rena
Author_Institution :
ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
In this paper, we present a RF/FSO dual mode communication module formed by a Ka-band patch antenna and optoelectronic components. A LED and a PiN diode are bonded on the patch antenna as the front-end transceiver of the FSO communication channel. The patch antenna is modified to accommodate LED/PiN assembly with minimized crosstalk between the RF channel and the optical channel. Both the simulation and the experimental measurement validate that the interference between the Ka-band RF signals and the visible/infra-red optical signal is negligible. This new module can achieve 5 Gbps end-to-end FSO data transmission with RF channel backup.
Keywords :
electronics packaging; indoor communication; light emitting diodes; microstrip antennas; optical transceivers; p-i-n diodes; Ka-band patch antenna; LED; PiN diode; RF channel backup; RF-FSO dual mode communication module; bit rate 5 Gbit/s; dual-mode indoor wireless communication; end-to-end transmission; free space optical communication; front-end transceiver; optical channel; optoelectronic components; packaging; visible-infrared optical signal; Antenna measurements; Antenna radiation patterns; Bonding; Optical transmitters; Patch antennas; Radio frequency;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898685
