DocumentCode :
1731336
Title :
Overcoming chip-to-chip delays and clock skews
Author :
Even, Guy ; Litman, Ami
Author_Institution :
Fachbereich Inf., Saarlandes Univ., Saarbrucken, Germany
fYear :
1996
Firstpage :
199
Lastpage :
208
Abstract :
In general, mapping a circuit onto several chips incurs a physical setting which differs from those within a chip. Specifically, the delay of chip-to-chip interconnections is much longer than on-chip delays of wires and gates. This delay effects the bandwidth as well. In addition, the clock skew between chips is larger than the clock skew within a chip. One may mistakenly conclude that the feasible clock period of a systolic array cannot be smaller than the maximal delay of an interconnection in a realization of the circuit. This paper proposes a technique for mapping large systolic linear arrays and systolic two-dimensional arrays onto several chips while almost maintaining the clock rates which are obtainable when these circuits are small enough to fit into a single chip. Our solution does not rely on special analogue techniques. It is described in a sequence of transformations (logic duplication and retiming), reductions, and an implementation of interconnections which have a required behavior in a given physical setting. It is shown that each step preserves functionality, and subsequently, the correctness of the proposed solution is implied
Keywords :
delays; logic design; systolic arrays; chip-to-chip delays; chip-to-chip interconnections; clock skews; feasible clock period; functionality; large systolic linear arrays; logic duplication; retiming; systolic array; systolic two-dimensional arrays; Ambient intelligence; Bandwidth; Clocks; Computer science; Delay effects; Integrated circuit interconnections; Logic; Systolic arrays; Very large scale integration; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Application Specific Systems, Architectures and Processors, 1996. ASAP 96. Proceedings of International Conference on
Conference_Location :
Chicago, IL
ISSN :
2160-0511
Print_ISBN :
0-8186-7542-X
Type :
conf
DOI :
10.1109/ASAP.1996.542815
Filename :
542815
Link To Document :
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