• DocumentCode
    1731336
  • Title

    Overcoming chip-to-chip delays and clock skews

  • Author

    Even, Guy ; Litman, Ami

  • Author_Institution
    Fachbereich Inf., Saarlandes Univ., Saarbrucken, Germany
  • fYear
    1996
  • Firstpage
    199
  • Lastpage
    208
  • Abstract
    In general, mapping a circuit onto several chips incurs a physical setting which differs from those within a chip. Specifically, the delay of chip-to-chip interconnections is much longer than on-chip delays of wires and gates. This delay effects the bandwidth as well. In addition, the clock skew between chips is larger than the clock skew within a chip. One may mistakenly conclude that the feasible clock period of a systolic array cannot be smaller than the maximal delay of an interconnection in a realization of the circuit. This paper proposes a technique for mapping large systolic linear arrays and systolic two-dimensional arrays onto several chips while almost maintaining the clock rates which are obtainable when these circuits are small enough to fit into a single chip. Our solution does not rely on special analogue techniques. It is described in a sequence of transformations (logic duplication and retiming), reductions, and an implementation of interconnections which have a required behavior in a given physical setting. It is shown that each step preserves functionality, and subsequently, the correctness of the proposed solution is implied
  • Keywords
    delays; logic design; systolic arrays; chip-to-chip delays; chip-to-chip interconnections; clock skews; feasible clock period; functionality; large systolic linear arrays; logic duplication; retiming; systolic array; systolic two-dimensional arrays; Ambient intelligence; Bandwidth; Clocks; Computer science; Delay effects; Integrated circuit interconnections; Logic; Systolic arrays; Very large scale integration; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application Specific Systems, Architectures and Processors, 1996. ASAP 96. Proceedings of International Conference on
  • Conference_Location
    Chicago, IL
  • ISSN
    2160-0511
  • Print_ISBN
    0-8186-7542-X
  • Type

    conf

  • DOI
    10.1109/ASAP.1996.542815
  • Filename
    542815