DocumentCode
1731625
Title
Ways of achieving high-performance MRAMs
Author
Motoyoshi, M. ; Kano, H.
Author_Institution
Technol. Dev. Group, Sony Corp., Atsugi, Japan
fYear
2005
Firstpage
82
Lastpage
83
Abstract
Recent MRAM developments and critical issues, such as universal memory requirements in the future, are discussed. Highly self-aligned techniques enable us to shrink cell size to the embedded-DRAM level. Toggle-mode MRAMs (L.Savtchenko et al. and M.Durlam et al., 2003) have a wide programming margin and a sufficiently small error rate for high-density memories, achieving cell stability. A large tunneling magnetoresistance (TMR) value is essential for high-speed read access, and MgO, as a tunnel barrier, promises to improve this drastically (W.H. Butler et al., 2001 and J. Mathon et al., 2001). The use of cladding bit lines (BLs) and word lines (WLs) has become a popular technique to reduce programming current. Moreover, adding an external magnetic field to a toggle-mode MRAM effectively reduces this. Finally, we briefly discuss spin transfer switching (STS) operation as a challenge to be faced in the future (J.C. Slonczewski, 1996).
Keywords
DRAM chips; magnetic fields; magnetic storage; tunnelling magnetoresistance; cell stability; cladding bit lines; embedded-DRAM level; high-density memories; high-performance MRAM; high-speed read access; magnetic field; magnetic random access memory; programming current; self-aligned techniques; spin transfer switching operation; toggle-mode MRAM; tunnel barrier; tunneling magnetoresistance value; universal memory requirements; word lines; Information technology; Laboratories; Logic; Magnetic tunneling; Production; Random access memory; Read-write memory; Sociotechnical systems; Stability; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2005. (VLSI-TSA-Tech). 2005 IEEE VLSI-TSA International Symposium on
ISSN
1930-8868
Print_ISBN
0-7803-9058-X
Type
conf
DOI
10.1109/VTSA.2005.1497089
Filename
1497089
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