Millimeter-wave multichip BGA package for InP circuits utilizing a laminated ceramic and organic substrate

Author

Schott, Donald

Author_Institution

Agilent Technol., Inc., Colorado Springs, CO, USA

fYear

2011

Firstpage

1562

Lastpage

1566

Abstract

The packaging of millimeter-wave Indium Phosphide (InP) Application Specification Integrated Circuits (ASICs) presents significant challenges particularly with respect to high speed signal interconnections and thermal management. A packaging technology for multichip InP systems is presented that combines the advantageous thermal and electrical properties of traditional ceramic and metal RF microcircuits with the high density and surface mount capabilities of an organic ball grid array (BGA). A specific 50 mm body outline design housing five custom InP ASICs comprising the front-end circuits of a 32 GHz real time oscilloscope is presented as an example of this device. The package and substrate components are described in detail. Fabrication and assembly processes are described. Electrical and thermal performance simulation and verification is presented. Reliability test results are presented.

Keywords

III-V semiconductors; MIMIC; application specific integrated circuits; ball grid arrays; ceramic packaging; indium compounds; integrated circuit interconnections; integrated circuit reliability; microassembling; oscilloscopes; ASIC; InP; InP circuits; application specification integrated circuits; assembly processes; electrical performance simulation; electrical property; frequency 32 GHz; front-end circuits; high speed signal interconnections; laminated ceramic substrate; metal RF microcircuits; millimeter-wave multichip BGA package; multichip InP systems; organic ball grid array; organic substrate; real time oscilloscope; reliability test; size 50 mm; thermal management; thermal performance simulation; thermal property; Ceramics; Indium phosphide; Integrated circuits; Metals; Millimeter wave technology; Substrates; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-61284-497-8

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2011.5898718

Filename

5898718