DocumentCode :
1731873
Title :
Thermally driven microactuator containing thermal isolation structure with polyimide and its application to microvalve
Author :
Kawada, H. ; Yoshida, H. ; Kamakura, M. ; Yoshida, K. ; Saitou, M. ; Kawahito, K. ; Tomonari, S.
Author_Institution :
Matsushita Electr. Works Ltd., Kadoma, Japan
Volume :
2
fYear :
2003
Firstpage :
1935
Abstract :
We have developed a thermally /spl middot/ isolated bimorph structure based on a silicon (Si) /nickel (Ni) pair. A 2.5-mm-long beam of the bimorph was thermally isolated by a polyimide comb from the rest of the Si structure. The Si and Ni layers of the bimorph were 30 /spl mu/m and 25 /spl mu/m thick, respectively. This geometry enabled us to generate the bending displacement (the stroke) of the free end of the bimorph up to 100 /spl mu/m at about 100 /spl deg/C with a generated force of about 15 mN. A low-voltage actuation (<3V) and low-energy consumption (<0.2W) were achieved. Besides, the miniaturized Si/Ni bimorph actuator was incorporated into the valve structure. The actual size of the fabricated valve is 7.3/spl times/5.8/spl times/1.2 mm/sup 3/. The flow rate from 0 to 500 ml/min at the air pressure of 47 kPa with low leakage rate of 0.03 ml/min and good linearity of the air pressure control were achieved.
Keywords :
bending; elemental semiconductors; flow measurement; microactuators; nickel; polymers; silicon; 100 degC; 2.5 mm; 25 micron; 30 micron; 47 kPa; Si-Ni; Si/Ni pair; air pressure control; bending stroke; flow rate; microvalve; polyimide comb; silicon/nickel pair; thermally driven microactuator; thermally isolated biomorph structure; Actuators; Geometry; Linearity; Microactuators; Microvalves; Nickel; Polyimides; Pressure control; Silicon; Valves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
Type :
conf
DOI :
10.1109/SENSOR.2003.1217171
Filename :
1217171
Link To Document :
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