DocumentCode
1732156
Title
Reliability improvement on HfO2 nMOSFETs by replacing polySi gate with TaSiN gate
Author
Bu, H.M. ; Song, L.Y. ; Ma, T.P. ; Tseng, H.-H. ; Hebert, L. ; Tobin, P.J.
Author_Institution
Yale Univ., New Haven, CT, USA
fYear
2005
Firstpage
130
Lastpage
131
Abstract
This paper reports significantly improved charge trapping lifetime of HfO2 nMOSFETs by using TaSiN gate instead of polySi gate. It demonstrates that the trapping induced threshold voltage shift is much more of a concern than TDDB in determining the device operating lifetime. A trapping model with a continuous distribution in trapping capture cross section has been used to extrapolate the device lifetime. Charge pumping results suggest the improvement on trapping lifetime is due to reduced bulk trap density in TaSiN gated HfO2 nMOSFETs.
Keywords
MOSFET; hafnium compounds; semiconductor device models; semiconductor device reliability; silicon compounds; tantalum compounds; HfO2; TaSiN; bulk trap density; charge pumping; charge trapping lifetime; device operating lifetime; nMOSFET; reliability improvement; trapping induced threshold voltage shift; trapping model; Breakdown voltage; Charge measurement; Charge pumps; Current measurement; Data mining; Frequency dependence; Hafnium oxide; MOSFETs; Stress; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2005. (VLSI-TSA-Tech). 2005 IEEE VLSI-TSA International Symposium on
ISSN
1930-8868
Print_ISBN
0-7803-9058-X
Type
conf
DOI
10.1109/VTSA.2005.1497109
Filename
1497109
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