• DocumentCode
    17322
  • Title

    Novel Balanced Bandpass Filters Using Substrate Integrated Half-Mode Waveguide

  • Author

    Min-Hua Ho ; Cheng-Siou Li

  • Author_Institution
    Dept. of Electron. Eng., Nat. Changhua Univ. of Educ., Changhua, Taiwan
  • Volume
    23
  • Issue
    2
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    78
  • Lastpage
    80
  • Abstract
    The contribution of this work is to propose novel balanced bandpass filters (BPFs) using the half-mode substrate integrated waveguide (HMSIW) and its size-reduced form, a folded HMSIW structure. The size of an HMSIW is about half of the substrate integrated waveguide (SIW) and the size of the folded HMSIW further reduces to 25%. Besides compactness, the proposed BPFs are attractive because the thru-via array needed for providing the side-wall effect is no longer required. In addition, the common-mode (CM) rejection of the HMSIW BPF is achieved from the non-coupling slots, caused by the PMC. The CM rejection of the folded HMSIW BPF is obtained by up-shifting the CM operating frequency far away from the differential-mode (DM) passband. Prototypes of the proposed circuits are fabricated and measured to present CM rejection levels larger than 40 dB over a wide frequency range and DM insertion losses around 2 dB in the passbands. Agreements between measured and simulated data are observed to validate the circuit design and performance.
  • Keywords
    band-pass filters; network synthesis; substrate integrated waveguides; waveguide filters; DM insertion loss; HMSIW; balanced bandpass filters; circuit design; common mode rejection; differential mode passband; half-mode substrate integrated waveguide; side wall effect; thru-via array; Arrays; Band pass filters; Couplings; Frequency measurement; Microstrip; Substrates; Wireless communication; Balanced bandpass filter (BPF); folded substrate integrated half-mode waveguide; half-mode substrate integrated waveguide (HMSIW);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2013.2238911
  • Filename
    6415314