Title :
Contact and force control in microassembly
Author :
Shen, Yantao ; Xi, Ning ; Li, Wen Jung
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Abstract :
This paper aims at advancing micromanipulation technology with in-situ PVDF piezoelectric force sensing and control during microassembly and packaging process. To allow close monitoring of magnitude and direction of forces (surface, friction, and assembly force) acting on micro devices during manipulation, the polyvinylidene fluoride (PVDF) is used to fabricate highly sensitive 1-D and 2-D force sensors for assembly of micro devices. By using the designed force sensors with the effective signal processing techniques, the contact force/impact signal can be obtained desirably so that it greatly improves the reliability of force regulation in microassembly. Moreover, based on a new sensor-referenced control method, the force control had been implemented by employing a micromanipulator system equipped with the force sensor and its results verify the effectiveness of sensor model as well as the performance of force feedback and control system. Ultimately the technology will provide a critical and major step towards the development of automated manufacturing processes for batch assembly of micro devices.
Keywords :
control systems; force control; force feedback; force sensors; manufacturing processes; microassembling; micromanipulators; micromechanical devices; piezoelectric devices; 1-D force sensors; 2-D force sensors; automated manufacturing processes; batch assembly; contact control; control system; force control; force direction; force feedback; force regulation; force reliabilty; force sensor designing; magnitude monitoring; micro devices; microassembly; micromanipulation technology; micromanipulator system; packaging process; piezoelectric force control; piezoelectric force sensing; polyvinylidene fluoride; signal processing techniques; Assembly; Force control; Force sensors; Friction; Microassembly; Micromanipulators; Monitoring; Packaging; Signal design; Signal processing;
Conference_Titel :
Assembly and Task Planning, 2003. Proceedings of the IEEE International Symposium on
Print_ISBN :
0-7803-7770-2
DOI :
10.1109/ISATP.2003.1217188