Title :
Dielectric properties of epoxy composite materials with interpenetrating polymer networks
Author :
Kim, Kyung-Hwan ; Kim, Myung-Ho ; Son, In-Hwan ; Kim, Jae-Hwan
Author_Institution :
Dept. of Electr. Eng, Kyungwon Univ., Kyunggi, South Korea
Abstract :
In this paper, the influence of interpenetrating polymer network (IPN) introduction on the dielectric properties, heat proof properties, internal structure and defects of the Epoxy/SiO2 composite materials, were investigated. We reported a relation between network structure and electrical properties, especially dielectric properties with variation of network structures for epoxy composite materials. According to experimental results, the samples, which have single network structures, have lower dielectric constant than IPN samples, but have relatively larger dependency to variation of temperature and frequency. It was confirmed that introducing of IPN insulating materials attains change of structures. Therefore it is counted that introduction of multiple structure including IPN is necessary to improve heat proof and electrical properties
Keywords :
composite insulating materials; epoxy insulation; filled polymers; permittivity; polymer blends; SiO2; defects; dielectric constant; dielectric properties; epoxy composite material; heat proof properties; insulating material; internal structure; interpenetrating polymer network; Composite materials; Curing; Dielectric constant; Dielectrics and electrical insulation; Educational institutions; Electromagnetic wave absorption; Epoxy resins; Moon; Polymers; Temperature;
Conference_Titel :
Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
Conference_Location :
Arlington, VA
Print_ISBN :
0-7803-4927-X
DOI :
10.1109/ELINSL.1998.704687