DocumentCode :
1733557
Title :
Dielectric properties of epoxy composite materials with interpenetrating polymer networks
Author :
Kim, Kyung-Hwan ; Kim, Myung-Ho ; Son, In-Hwan ; Kim, Jae-Hwan
Author_Institution :
Dept. of Electr. Eng, Kyungwon Univ., Kyunggi, South Korea
Volume :
1
fYear :
1998
Firstpage :
161
Abstract :
In this paper, the influence of interpenetrating polymer network (IPN) introduction on the dielectric properties, heat proof properties, internal structure and defects of the Epoxy/SiO2 composite materials, were investigated. We reported a relation between network structure and electrical properties, especially dielectric properties with variation of network structures for epoxy composite materials. According to experimental results, the samples, which have single network structures, have lower dielectric constant than IPN samples, but have relatively larger dependency to variation of temperature and frequency. It was confirmed that introducing of IPN insulating materials attains change of structures. Therefore it is counted that introduction of multiple structure including IPN is necessary to improve heat proof and electrical properties
Keywords :
composite insulating materials; epoxy insulation; filled polymers; permittivity; polymer blends; SiO2; defects; dielectric constant; dielectric properties; epoxy composite material; heat proof properties; insulating material; internal structure; interpenetrating polymer network; Composite materials; Curing; Dielectric constant; Dielectrics and electrical insulation; Educational institutions; Electromagnetic wave absorption; Epoxy resins; Moon; Polymers; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
Conference_Location :
Arlington, VA
ISSN :
1089-084X
Print_ISBN :
0-7803-4927-X
Type :
conf
DOI :
10.1109/ELINSL.1998.704687
Filename :
704687
Link To Document :
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