DocumentCode
1733964
Title
In-plane/out-of-plane mixed probe techniques to obtain the RF characteristics of SMA connectors
Author
Lu, Kuan-Chung ; Horng, Tzyy-Sheng ; Hwang, Lih-Tyng
Author_Institution
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
fYear
2011
Firstpage
2033
Lastpage
2036
Abstract
In this study, a Short-Open-Load-Reciprocal (SOLR) calibration procedure is conducted to obtain the RF characteristics of an adaptor (the traces between the edge of the package and the SMA connectors) on a test board. The RF characteristics are used in a post-processing technique to obtain the true RF performance of the IC inside the package. Due to the unique physical configuration of the adaptor (closely spaced at one end), a mixed coplanar-to-connector measurement technique is needed to obtain the RF characteristics. To the knowledge of the authors, this problem has not previously been studied. After the RF characteristics of the adaptor are obtained herein, the RF performance of SMA connectors, either in-plane (horizontal), or out-of-plane (vertical), is extracted. We found that the horizontally and vertically oriented SMA connectors introduced additional delay, attenuation, and mismatch to the planar traces on the test board. The measurements were made up to 12 GHz.
Keywords
calibration; electric connectors; integrated circuit packaging; integrated circuit reliability; SMA connectors; in-plane/out-of-plane mixed probe techniques; mixed coplanar-to-connector measurement technique; post-processing technique; short-open-load-reciprocal calibration; Calibration; Connectors; Delay; Probes; Radio frequency; Transmission line matrix methods; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898796
Filename
5898796
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