• DocumentCode
    1733964
  • Title

    In-plane/out-of-plane mixed probe techniques to obtain the RF characteristics of SMA connectors

  • Author

    Lu, Kuan-Chung ; Horng, Tzyy-Sheng ; Hwang, Lih-Tyng

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • fYear
    2011
  • Firstpage
    2033
  • Lastpage
    2036
  • Abstract
    In this study, a Short-Open-Load-Reciprocal (SOLR) calibration procedure is conducted to obtain the RF characteristics of an adaptor (the traces between the edge of the package and the SMA connectors) on a test board. The RF characteristics are used in a post-processing technique to obtain the true RF performance of the IC inside the package. Due to the unique physical configuration of the adaptor (closely spaced at one end), a mixed coplanar-to-connector measurement technique is needed to obtain the RF characteristics. To the knowledge of the authors, this problem has not previously been studied. After the RF characteristics of the adaptor are obtained herein, the RF performance of SMA connectors, either in-plane (horizontal), or out-of-plane (vertical), is extracted. We found that the horizontally and vertically oriented SMA connectors introduced additional delay, attenuation, and mismatch to the planar traces on the test board. The measurements were made up to 12 GHz.
  • Keywords
    calibration; electric connectors; integrated circuit packaging; integrated circuit reliability; SMA connectors; in-plane/out-of-plane mixed probe techniques; mixed coplanar-to-connector measurement technique; post-processing technique; short-open-load-reciprocal calibration; Calibration; Connectors; Delay; Probes; Radio frequency; Transmission line matrix methods; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-61284-497-8
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2011.5898796
  • Filename
    5898796