DocumentCode :
1734302
Title :
Metamaterial-inspired absorbers for Terahertz packaging applications
Author :
Park, Kyoung Youl ; Hejase, Jose A. ; Meierbachtol, Collin S. ; Wiwatcharagoses, Nophadon ; Chahal, Prem
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
fYear :
2011
Firstpage :
2107
Lastpage :
2113
Abstract :
In this paper, thin metamaterial-inspired structures are investigated for wide-band absorption of stray signals for THz packages. The absorber itself consists of a low-index, low-loss dielectric sandwiched between a patterned, two-dimensionally periodic, thin metallic layer, and a metal backing. Numerical simulations were performed using both the finite element (FEM) and finite-difference time domain (FDTD) numerical methods. Design, fabrication and tests were carried out for absorbers having center frequencies of 0.2 THz and 0.4 THz. Ultra-wide bandwidth and strong absorption were obtained by taking advantage of skin-effect losses in metamaterial structures, and through multi-stacking of these structures. Absorbers having high absorption coefficients and bandwidth (>; 1THz) can easily be fabricated using the approach demonstrated in this paper. Two measurement approaches are applied to characterize these structures, details of which are presented in this paper.
Keywords :
electronics packaging; metamaterials; terahertz wave devices; THz packages; finite element method; finite-difference time domain method; metal backing; metamaterial structures; metamaterial-inspired absorbers; skin-effect losses; stray signals; terahertz packaging applications; thin metallic layer; thin metamaterial-inspired structures; wide-band absorption; Absorption; Dielectrics; Electromagnetic waveguides; Metals; Metamaterials; Reflection; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2011.5898809
Filename :
5898809
Link To Document :
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