• DocumentCode
    1734581
  • Title

    Solder Bead on High Density Interconnect Printed Circuit Board

  • Author

    Chu, Brandon

  • Author_Institution
    Intel Corp., Hillsboro, OR
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Solder bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards (PCBs). High Density Interconnect (HDI) PCBs are gaining in popularity to support high speed and smaller form factor requirements. This paper summarizes the requirements for placing solder beads on HDI PCBs.
  • Keywords
    printed circuits; solders; HDI PCB; Solder bead probing; high density interconnect printed circuit board; Apertures; Circuit testing; Electronics packaging; Graphics; Integrated circuit interconnections; Printed circuits; Routing; Signal resolution; US Department of Energy; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700590
  • Filename
    4700590
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1734581