Design and characterization of power delivery system for multi-chip package with embedded discrete capacitors

An innovative embedded passive solution which directly embeds surface mount discrete (SMD) capacitor in the package substrate is presented. Comparing with embedded planar capacitor, the embedded discrete capacitor technology provides more design feasibilities for decoupling purpose. The capacitors can be placed underneath the chip to reduce the loop inductance. In this paper, characterization of embedded discrete capacitors in multi-chip package (MCP) is presented. The chip, package and print circuit board (PCB) co-simulation to well design the embedded discrete substrate is demonstrated. Power delivery system (PDS) performance is studied in both the frequency and time domains. The peak to peak noise in PDS has been reduced substantially through design and characterization methodology proposed.