Title :
Finding Power/Ground Defects on Connectors - Case Study
Author :
Hird, Steve ; Weng, Reggie
Author_Institution :
Agilent Technol., Loveland, CO
Abstract :
As printed circuit boards are steadily becoming faster, existing test technologies leave significant holes in coverage. In 2007 we presented a new approach to detecting power and ground defects using "network parameter measurements". This paper analyses the effectiveness of this technique in a high volume manufacturing environment.
Keywords :
network parameters; printed circuit design; printed circuit testing; network parameter measurement; power-ground defect; printed circuit boards; Circuit testing; Connectors; Electronic equipment testing; Leg; Pins; Power measurement; Printed circuits; Pulp manufacturing; Sockets; Volume measurement;
Conference_Titel :
Test Conference, 2008. ITC 2008. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-2402-3
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2008.4700591
