• DocumentCode
    1734632
  • Title

    Finding Power/Ground Defects on Connectors - Case Study

  • Author

    Hird, Steve ; Weng, Reggie

  • Author_Institution
    Agilent Technol., Loveland, CO
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As printed circuit boards are steadily becoming faster, existing test technologies leave significant holes in coverage. In 2007 we presented a new approach to detecting power and ground defects using "network parameter measurements". This paper analyses the effectiveness of this technique in a high volume manufacturing environment.
  • Keywords
    network parameters; printed circuit design; printed circuit testing; network parameter measurement; power-ground defect; printed circuit boards; Circuit testing; Connectors; Electronic equipment testing; Leg; Pins; Power measurement; Printed circuits; Pulp manufacturing; Sockets; Volume measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700591
  • Filename
    4700591
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1734632