• DocumentCode
    1734725
  • Title

    An Effective and Flexible Multiple Defect Diagnosis Methodology Using Error Propagation Analysis

  • Author

    Yu, Xiaochun ; Blanton, R. D Shawn

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    A multiple defect diagnosis methodology consisting of a defect site identification and elimination method, a path-based defect site elimination method, and a defect site selection and ranking method is described. The flexibility of the diagnosis method in handling various defect behaviors and arbitrary failing pattern characteristics is demonstrated through extensive simulations. Unlike some competing approaches, the search space of the diagnosis method does not grow exponentially with the number of defects. Results from over 1700 simulated and 131 failing ICs show that this method can effectively diagnose circuits that are affected by a large (>20) or small number of defects of various types. Specifically, when diagnosing circuits with more than 20 defects, our method identifies 65% of them, and the number of sites reported per actual defective site is, on average, 1.17. For circuits affected by two defects, these numbers change to 86% and 1.85, respectively. Finally, 84% of our top-ranked sites are actual defect sites.
  • Keywords
    integrated circuits; defect site identification-elimination method; error propagation analysis; flexible multiple defect diagnosis methodology; integrated circuit diagnosis; ranking method; Automatic test pattern generation; Bridge circuits; Circuit faults; Circuit simulation; Circuit testing; Computer errors; Coupling circuits; Error analysis; Fault diagnosis; Integrated circuit interconnections;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700595
  • Filename
    4700595