Title :
Preventing RFIC interference issues: A modeling methodology for floorplan development and verification of isolation- and grounding strategies
Author :
Niehof, J. ; van Sinderen, J.
Author_Institution :
NXP Semicond., Eindhoven, Netherlands
Abstract :
In order to prevent interference issues it is essential to make the right choices/trade-offs in the early phases of the IC design. A modeling methodology was developed to study the impact of physical design choices on the isolation behavior of the overall packaged and mounted RF product. This paper gives an overview of the various coupling paths and their relative contribution in the isolation/coupling. The simulation/modeling results are in good agreement with measurements.
Keywords :
circuit layout; earthing; radiofrequency integrated circuits; RFIC interference issue; coupling paths; floorplan development; grounding strategy; isolation; physical design; Couplings; Grounding; Integrated circuit modeling; Noise; Radio frequency; Radiofrequency integrated circuits; Receivers;
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2011 15th IEEE Workshop on
Conference_Location :
Naples
Print_ISBN :
978-1-4577-0466-6
Electronic_ISBN :
978-1-4577-0465-9
DOI :
10.1109/SPI.2011.5898830
