Multilayer (3D) Wireless, RF and Millimeter-Wave Passives and Modules Using SOP Technology

Emerging wireless communication and sensor applications in the RF/microwave/millimeter (mm) wave regimes require miniaturization, portability, cost, and performance as key driving forces in the electronics packaging evolution. The system-on-package (SOP) approach [versus the system-on-chip (SOC)] for module development (Lim et al., 2002) has become a primary focus of research due to the real estate efficiency, cost-saving, size reduction, and performance improvement contributed by its inherent capability for the easy integration of embedded functions, thus, simultaneously satisfying the specifications of the next generation wireless communication systems. Also, the three-dimensional (3-D) integration approach is an emerging and very attractive option for these systems. However, current 3-D RF module integration is still based on low-density hybrid assembly technologies (Sturdivant et al., 1997), (Monfraix et al., 200). This paper presents novel liquid crystal polymer (LCP) multilayer technologies, and stacking board technique using uBGA as the candidates of choice for the 3-D integration of RF front-end modules up to 35 GHz