Title :
WLR monitoring stresses and suitable test structures for future product reliability targets
Author :
Martin, Andreas ; Kerber, Martin ; Diestel, Gunnar
Author_Institution :
Reliability Methodologies, Infineon Technol. AG, Munich, Germany
fDate :
6/21/1905 12:00:00 AM
Abstract :
The demands on gate oxide qualification and monitoring and their limits are discussed in detail. Methods are presented to demonstrate the customers reliability requirements through a combination of experiments and extrapolation. The motivation for this work was the visualisation of the discrepancy between today´s qualification and monitoring possibilities and tomorrow´s customers targets. Realistically, the effort to demonstrate the reliability targets experimentally is limited and will be too high for future reliability targets. The paper consists of two main parts, a discussion of an approach to assess today´s stringent failure rate targets through reliability measurements and the extrapolation of Weibull distributions. Steps towards building-in-reliability (BIR) are mentioned in this paper, when appropriate, but are not further discussed
Keywords :
Weibull distribution; integrated circuit reliability; integrated circuit testing; monitoring; WLR; Weibull distributions; building-in-reliability; customers reliability requirements; failure rate targets; gate oxide qualification; monitoring stresses; product reliability targets; test structures; Circuit testing; Circuits and systems; Condition monitoring; Extrapolation; Process design; Qualifications; Reliability engineering; Semiconductor device manufacture; Semiconductor device reliability; Stress;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1999. IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-5649-7
DOI :
10.1109/IRWS.1999.830572