مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

1735815

Title :

Electromigration

Author :

Sullivan, Timothy

Author_Institution :

IBM Microelectronics

fYear :

1999

fDate :

6/21/1905 12:00:00 AM

Firstpage :

136

Lastpage :

137

Keywords :

Electromigration; Guidelines; Life estimation; Manufacturing; NIST; Qualifications; Rivers; Stress; Temperature; Testing;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Integrated Reliability Workshop Final Report, 1999. IEEE International

Print_ISBN :

0-7803-5649-7

Type :

conf

DOI :

10.1109/IRWS.1999.830576

Filename :

830576

Link To Document :