• DocumentCode
    1735891
  • Title

    Extraction, Simulation and Test Generation for Interconnect Open Defects Based on Enhanced Aggressor-Victim Model

  • Author

    Hillebrecht, Stefan ; Polian, Ilia ; Engelke, Piet ; Becker, Bernd ; Keim, Martin ; Cheng, Wu-Tung

  • Author_Institution
    Comput. Archit. Group, Albert-Ludwigs-Univ., Freiburg
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    We present a flow to extract, simulate and generate test patterns for interconnect open defects. In contrast to previous work, the accuracy of defect modeling is improved by taking the thresholds of logic gates as well as noise margins into account. Efficient fault simulation is enabled by employing an aggressive fault collapsing strategy and an optimized fault list ordering heuristic which allows to combine the advantages of event-driven simulation with bit parallelism. Test generation complexity is kept in check by generating patterns for technology-independent segment-stuck-at faults first, thus reducing (though not completely eliminating) the need for sophisticated technology-aware test generation. Moreover, a comprehensive untestability analysis identifies new classes of untestable faults. Experimental results demonstrate high efficiency of the new flow, outperforming earlier work by two orders of magnitude.
  • Keywords
    integrated circuit interconnections; aggressor-victim model; fault collapsing strategy; interconnect open defects; logic gates; noise margins; technology-aware test generation; technology-independent segment-stuck-at faults; Automatic test pattern generation; CMOS technology; Circuit faults; Computational modeling; Discrete event simulation; Integrated circuit interconnections; Integrated circuit technology; Test pattern generators; Testing; Threshold voltage; ATPG; Interconnect opens; Open-via defects; fault simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700642
  • Filename
    4700642