• DocumentCode
    1736038
  • Title

    Reliability engineering-an integrated approach at Daimler Chrysler

  • Author

    Renner, J.H.

  • Author_Institution
    RMC Reliability Technol. GmbH, Stuttgart
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    152
  • Lastpage
    153
  • Abstract
    Innovative technologies for automobiles are not only subject to extreme demands as to robustness and reproduceability but also challenged by cost and time to market. Especially today the unprecedented increase of electronic devices and parts and the accelerating growth of complexity in automotive systems require a new understanding of quality and reliability. Reliability engineering at Daimler-Chrysler as a qualified interface for DC-suppliers provides technical and mathematical tools to efficiently verify and improve quality and reliability. Comprising comprehensive definitions of mission life stress profiles and long term stability attributes for products and processes, technology and risk assessment as well as reliability prediction the reliability engineering concept starts with virtual and fractal decomposition of the product, followed by a systematic application of conform analysis and verification methods at relevant decomposition levels. Risk technologies, processes, components, systems etc. will be indicated, critical elements eliminated or optimized to exclude systematic and/or stochastic failures in parts and manufacturing flows. By applying consistent qualification and ramp up procedures and continuous observation, the approach provides early indicators for product and process quality with respect to anomalies and trends as well. Summarized reports of results will support corrective actions based on a deep understanding of failure physics to optimize sensitive paths and to minimize field returns
  • Keywords
    automobile industry; automotive electronics; semiconductor device reliability; Daimler Chrysler; automobiles; cost; electronic devices; integrated approach; long term stability attributes; mission life stress profiles; reliability engineering; reproduceability; robustness; time to market; Acceleration; Automobiles; Automotive engineering; Consumer electronics; Costs; Reliability engineering; Robustness; Stability analysis; Stress; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 1999. IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-5649-7
  • Type

    conf

  • DOI
    10.1109/IRWS.1999.830584
  • Filename
    830584