• DocumentCode
    1736039
  • Title

    Problems Using Boundary-Scan for Memory Cluster Tests

  • Author

    Treuren, Bradford G Van ; Chiang, Chen-Huan ; Honaker, Kenneth

  • Author_Institution
    Alcatel-Lucent, Murray Hill, NJ
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Boundary-scan testing is used to overcome many of the testability issues facing today´s higher density designs. In the past, boundary-scan has been used successfully to perform interconnect testing between boundary-scan supporting devices. There has been an increased use of testing clusters of non-boundary-scan devices that are surrounded by boundary-scan access at the edge of the circuit both in manufacturing and system test. Boundary-scan is also being used to perform cluster testing of memory devices that do not support boundary-scan directly. These specialized boundary-scan tests are written to emulate a functional test pattern flow which requires a relatively precise control of the timing constraints in a synchronous clock window for synchronous dynamic random access memory (SDRAM). New interface architectures are also stressing the timing constraints available from a boundary-scan based test. This paper discusses the issues impeding boundary-scan based memory testing and suggests some alternative methods for testing these memory devices when boundary-scan testing is unattainable.
  • Keywords
    DRAM chips; boundary scan testing; SDRAM; boundary scan testing; cluster testing; memory cluster tests; synchronous clock window; synchronous dynamic random access memory; timing constraints; Circuit testing; Integrated circuit interconnections; Manufacturing; Microprogramming; Performance evaluation; Random access memory; SDRAM; Software testing; System testing; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700645
  • Filename
    4700645