DocumentCode :
1736041
Title :
Study of GaInP/InGaAs linear graded Schottky barrier double channel heterostructure field-effect transistors (GDCHFETs)
Author :
Lin, Kun-Wei ; Hsu, Chi-Hsiang ; Chen, Chia-Jung
Author_Institution :
Dept. & Grad. Inst. of Comput. Sci. & Inf. Eng., Chaoyang Univ. of Technol., Taichung
fYear :
2008
Firstpage :
191
Lastpage :
194
Abstract :
Fabrications of GalnP/InGaAs linear-grade Schottky barrier double channel heterostructure field effect transistors (GDCFETs) are presented. The DC and RF characteristics of the studied devices with 1 and 0.8 mum gate length are compared and studied. By using the linear-grade Schottky barrier layer, the drawback of parallel conduction at high stress operation (especially at high gate voltage or high operation temperature) is eliminated. In addition, due to the employed InGaAs structure and Schottky behaviors of InGaP "insulator", good pinch-off and saturation characteristics, higher and linear transconductance, and good RF performances are obtained. The maximum transconductance is 218 mS/mm and 221 mS/mm for 1 mum and 0.8 mum gate length, respectively. The output current, defined at VGs=1.2 V is 380 mA/mm and 434 mA/mm for 1 and 0.8 mum gate length, respectively. High-speed device operation has been verified, with fT of 15 GHz and fmax of 31 GHz for 1 and 0.8 mum gate length at room temperature. Therefore, the studied GDCHFETs provide the promise for high-temperature and high-performance microwave electronic applications.
Keywords :
Schottky barriers; high electron mobility transistors; GaInP-InGaAs; double channel heterostructure field effect transistor; frequency 15 GHz; frequency 31 GHz; linear grade Schottky barrier layer; transconductance; voltage 1.2 V; Fabrication; HEMTs; Indium gallium arsenide; MODFETs; Radio frequency; Schottky barriers; Stress; Temperature; Transconductance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2008. IWJT '08. Extended Abstracts - 2008 8th International workshop on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1737-7
Electronic_ISBN :
978-1-4244-1738-4
Type :
conf
DOI :
10.1109/IWJT.2008.4540048
Filename :
4540048
Link To Document :
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